



374324B00035G | |
|---|---|
DigiKey Part Number | HS318-ND |
Manufacturer | |
Manufacturer Product Number | 374324B00035G |
Description | HEATSINK BGA W/ADHESIVE TAPE |
Manufacturer Standard Lead Time | 14 Weeks |
Customer Reference | |
Detailed Description | Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level |
Datasheet | Datasheet |
Type | Description | Select All |
|---|---|---|
Category | ||
Mfr | ||
Series | ||
Packaging | Box | |
Part Status | Active | |
Type | Board Level | |
Package Cooled | ||
Attachment Method | Thermal Tape, Adhesive (Included) | |
Shape | Square, Pin Fins | |
Length | 1.063" (27.00mm) | |
Width | 1.063" (27.00mm) | |
Diameter | - | |
Fin Height | 0.394" (10.00mm) | |
Power Dissipation @ Temperature Rise | 3.0W @ 90°C | |
Thermal Resistance @ Forced Air Flow | 9.30°C/W @ 200 LFM | |
Thermal Resistance @ Natural | 30.60°C/W | |
Material | ||
Material Finish | Black Anodized | |
Shelf Life | - | |
Base Product Number |
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1 | $2.60000 | $2.60 |
| 10 | $2.29700 | $22.97 |
| 25 | $2.18800 | $54.70 |
| 50 | $2.10900 | $105.45 |
| 100 | $2.03280 | $203.28 |
| 250 | $1.93620 | $484.05 |
| 756 | $1.82553 | $1,380.10 |
| 1,512 | $1.75935 | $2,660.14 |
| 5,292 | $1.64560 | $8,708.52 |




